What to know about electromechanical interconnects for 5G systems

 As 5G technology continues to evolve and become more widely available, understanding the challenges and capabilities of electromechanical interconnects is crucial for device manufacturers looking to take advantage of the increased speeds and capabilities of the new network.


One of the main challenges facing 5G systems is the need for high performance and signal integrity at every point in the network, from the board level to the component level. To meet these demands, the industry is utilizing new techniques such as millimeter wave transmission, smaller and more cells, beamforming, and MIMO antenna technology.


The increased antenna density and signal paths in 5G devices also require high-density copper interconnects to support the transfer rates of PAM-4 modulations, which can reach speeds of 56 Gbps and 112 Gbps. To route these high-speed signals, advanced interconnect solutions such as twinaxial cable assemblies and improved edge connectors are necessary to avoid signal integrity issues and minimize costs and latency.


Additionally, the move from 4G to 5G also requires a shift in network topology, with a move away from legacy systems and towards more open and decentralized networks. This includes the use of new remote radio units, active antenna units, and baseband units that are connected through fronthaul networks using MIMO antennas.


As 5G networks continue to expand and evolve, it is important for device manufacturers to stay up-to-date on the latest developments in electromechanical interconnects to ensure their products can take full advantage of the increased speeds and capabilities of the new network. Solutions such as the NearStack 100 Ohm and 85 Ohm families from Molex and the NearStack On-the-Substrate system can support high-speed PAM-4 connections and provide the necessary signal integrity for 5G devices.

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